U.S. federal market
Advanced engineering and technology
Through our advanced engineering and technology services, CGI delivers expert analysis, design, prototyping and engineering to our U.S. defense, intelligence and federal civilian government clients by implementing state-of-the-art and emergent technologies to enhance information exchange, interoperability, data-sharing capabilities, Command and Control (C2) and weapons systems effectiveness.
Our primary advanced engineering and technology service offerings include:
- Advanced C4ISR engineering
- C2 and mission monitoring systems
- Domain and situational awareness
- Microsystems and electro-optic sensor technology
- RFID and autonomous sensor integration
- Service-oriented architecture design
Microsystems and electro-optic sensor technology
Today, one of the most significant trends in the defense and federal sectors is the use of, and demand for, real-time and near real-time data provided by deployed and embedded sensors. From homeland security applications to enhanced Intelligence Surveillance and Reconnaissance (ISR) requirements, micro- and sensor-based systems are increasingly being used to enhance situational awareness and our nation’s ability to rapidly respond to critical events as they happen.
To meet this mission need, we offer a robust micro-system and sensor capability to include structural health monitors, microelectromechanical systems (MEMS)-based sensors, system-on-chip (SoC) microcontrollers and micro-fluidic design and development services. Our micro-system and sensor engineering approach is focused on providing cost-effective solutions that are tailored for each operational context and the unique performance needs of our client.
Our leadership in this area is evidenced by our success in providing key MEMS and other sensor payloads to the Army, USMC, NASA and DARPA to help achieve their program’s goals and objectives.
Our microsystems and electro-optic sensor technology service offerings include:
- Closed Micro-Fluidic Valve – Micro-Fluidics is an emerging technology with potential this is not fully realized. As the technology evolves, the complexity of the networked micro-channels (small pipes measuring 0.999 to 0.001 mm in diameter) becomes more complex.
- Embedded Health Monitoring System for Composites – As sensors, micro/nanotechnologies and microelectronics become smaller and less intrusive, they are being used for new applications, including smart structures and smart materials. Of increasing interest is the ability to embed miniature devices and intelligence into structural materials, so that the formed structures are capable of determining the unit’s current and future state.
- Integrated Sensor Suites – In portable, embedded and unattended sensor suites and environmental dataloggers, one of the primary size and cost drivers is the suite of environmental sensors. In many cases, the analog signal processing, the electrical interconnect and the sensor device take up the majority of the available real estate.
- MEMS Advanced Structural Substrate Enabled IMU – The development of MEMS sensors, including inertial devices and 3D sensor packaging technology integrating both structural and electronic interposing functions, has resulted in inertial measurement capability that can potentially enable drastic size reductions compared to traditional technologies. However, the integration of MEMS sensors into functional and accurate systems using traditional electronics integration techniques results in IMUs that are still unacceptably large for some applications.
- MEMS Inertial Sensors – A number of inertial MEMS sensor devices and technologies have been under development, with various units being applied in air bag deployment, antiskid control, system pointing, and some navigation and control. Some applications, however, require high-performance inertial sensing that cannot be found in commercial devices.
- Miniature Optical Spectrometers – For applications ranging from airport and border security to drug discovery and space exploration, there is an increasing demand for miniature analytical instruments. Due to the sensing environments and protocols involved, these instruments have to provide sophisticated analysis of environments, chemicals, biological systems, and materials without consuming valuable size or power. In particular, the miniaturization of the powerful analytical tool of optical spectroscopy would open the door to new portable, autonomous and embedded sensing systems.
- No Power MEMS Shock Sensors – Our No-Power MEMS Shock Sensor is a miniature shock-triggered switch designed for applications requiring portable, long lifetime, embedded sensing devices that must monitor the shock environment continuously, but must do so while consuming extremely low power levels. The device is capable of a number of switch configurations, shock trigger levels (both single and multiple triggers) and response times.
- Packages for Exposed MEMS Sensors – Portable, embedded and autonomous sensor suites, sensor collection systems and environmental dataloggers are now being used to monitor environmental conditions—including humidity and chemical concentrations—and must often operate in extremely harsh environments. New chemical and humidity sensors are being developed for these applications, but technology for packaging the sensors has not kept pace. This type of packaging differs from standard microelectronics packaging in that there is a desire to let all or some of the environment interact with the sensor. In stark contrast, traditional microelectronics packaging has historically attempted to keep the component away from the environment as much as possible.
Services and capabilities are delivered by CGI Federal and its various Stanley subsidiaries.